LORD IMB 1020 Thermoplastic Injection Bonding Treatment
Single-component surface treatment that promotes bonding of thermoplastic materials to metals and other rigid substrates during injection molding.
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Role in injection molding
LORD IMB 1020 is applied to a rigid substrate to promote adhesion to the thermoplastic during injection molding. The solvent-based, single-component formulation contains dissolved polymers and curatives.
Its non-settling formulation requires no agitation before or during use. Apply by spray, brush or dip. The single-component system requires no mixing of adhesive components. Select the treatment for the actual thermoplastic grade, substrate and molding conditions.
Preparation and application
Remove oil, grease, fingerprints, dust, mold release agents, rust and other contamination from the bonding surfaces. Metal surfaces may be cleaned with a suitable alkaline degreaser, rinsed and allowed to dry thoroughly.
Brush and dip applications normally use IMB 1020 without dilution. Spray application uses a blend of methyl ethyl ketone (MEK) and toluene as diluent; confirm the blend preparation and dilution requirements in the applicable technical data sheet before mixing.
The recommended dry-film thickness is 25–40 μm. Allow 30–60 minutes of air drying at room temperature, or 3–5 minutes of hot-air drying at 65°C.
Typical properties
| Property | Typical value |
|---|---|
| Appearance | Clear liquid |
| Viscosity at 25°C | 100–300 cps, Brookfield LVT, spindle 2, 30 rpm |
| Density | 870–910 kg/m³ |
| Solids by weight | 20.5–23.5% |
Typical values are for reference, not product specifications. Confirm adhesion with the actual materials and injection molding process.
Supply and technical enquiries
Hongtu Chemical supplies LORD IMB 1020 as an authorized distributor. Contact our team for quotations, technical documents or advice on thermoplastic bonding during injection molding.
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